super bright round type led lamps ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-LHRF13743-PF-08 rev. : a date : 23- apr. - 2008 LHRF13743-PF pb lead-free parts
25.0min 1.0min 2.54typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 5.0 5.9 8.6 7.6 1.5max 0.5 typ part no. LHRF13743-PF package dimensions page 1/5 ligitek electronics co.,ltd. property of ligitek only
typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 symbol lens color part no emitted algainp red material storage temperature operating temperature power dissipation electrostatic discharge( * ) reverse current @5v forward current peak forward current duty 1/10@10khz parameter forward voltage @20ma(v) 2.4 max. min. 630201.5 spectral halfwidth nm dominant wave length dnm min. typ. luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) -40 ~ +100 tstg -40 ~ +85 esd t opr ir 2000 10 i fp pd i f 75 65 25 v a ma mw ma ligitek electronics co.,ltd. property of ligitek only ratings red unit page 2/5 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * LHRF13743-PF part no. LHRF13743-PF water clear 220 350 56
fig.3 forward voltage vs. temperature ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 0.8 40 020 1.1 1.0 0.9 1.2 ambient temperature( ) fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.5 80 60 0.0 0 -20 4060 20 1.5 1.0 2.0 2.5 80 forward voltage(v) fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 30 2.0 1.0 0 3.0 10 20 hrf chip 40 fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 0.0 1.0 2.0 forward current(ma) 101001000 ligitek electronics co.,ltd. property of ligitek only page 3/5 fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 550 0.0 0.5 650 1.0 700 0.5 01.52.5 50 60 LHRF13743-PF part no.
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 4/5 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) time(sec) 150 260 c3sec max 100 5 /sec max 50 preheat 2 /sec max 260 120 0 0 25 temp( c) part no. LHRF13743-PF 60 seconds max
page 5/5 reference standard this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test item operating life test high temperature storage test reliability test: the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 low temperature storage test high temperature high humidity test thermal shock test solder resistance test solderability test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. part no. LHRF13743-PF
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